Following the electromagnetic compatibility tests (see Integration at Shanghai: second half of May), integration and testing of the SVOM satellite continued: the solar panels were……
This fortnight began with susceptibility tests to detect any interference between the various instruments and the electronic boxes of the PIM (payload module) through the……
After the mechanical integration of the ECLAIRs and MXT instruments, it’s time for the electrical integrations, with the connection of the harnesses of the French……
At the end of last week, preparations for integrating MXT and ECLAIRs onto the PIM were completed: electrical and mechanical disconnection of MDPU/UGTS computers, panel……
Last week, the French instrument qualification models and their computers were disassembled and packed away. Testing is now continuing on the flight models. MXT and……
The electronic boxes of the two French instrument computers: ECLAIRs (UGTS box) and MXT (MDPU boxes) were attached to the PIM panels (Payload Interface Module,……
Video report recorded in the SVOM integration room at IAM CAS in Shanghai. Related Posts Satellite integration logbook Related Posts Satellite integration logbook
Week of 27 March: the ECLAIRs and MXT instruments were taken out of the transport boxes and placed on mechanical supports. The electronic boxes of……
The two instruments ECLAIRs and MXT, together with part of the French team, have arrived at the integration site, at the Innovation Academy for Microsatellites……
The French instruments ECLAIRs and MXT as well as the equipment necessary for the integration activities have left CNES for Shanghai. Related Posts Satellite integration……